FOUNDATION and FUNCTIONING of HEAT-SINK SOLUTIONS and COOLING APPROACHES

Abstract

The fast expansion of Information and Communication Technology (ICT) requires data centers to operate as essential facilities for handling large volumes of data processing and management functions. The heat dissipation system represents a significant part of data centers because it protects electronic components through heat dissipation to guarantee their reliable performance. This exploration examines cooling approaches including air systems and liquid instruments for their implementation as heat sinks for electronics. Using finned heat sinks for air cooling represents the dominant method because of its stripped-down design and economical value. Computational methods through liquid cooling that incorporate nanofluids boost heat transfer abilities yet demand expensive implementation and technical complexity. The analysis reviews different heat sink structures such as plate fin and pin fin and microchannel systems to evaluate thermal performance alongside mechanisms affecting heat transfer efficiency including geometry details and fluid movement dynamics and material choice choices. The article explores how nanofluids and phase change materials (PCMs) provide enhancements for heat management performance. Unlike previous reviews that focus on isolated cooling technologies, this comprehensive analysis integrates both traditional and emerging solutions while considering their practical implementation constraints in data center environments. The collected data demonstrates that air cooling remains prevalent but liquid cooling systems and innovative materials including nanofluids and PCMs deliver superior thermal performance specifically for powerful electronic devices, ultimately suggesting a hybrid approach may offer the optimal balance between cooling efficiency and operational costs.